Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects
نویسندگان
چکیده
Thermal fatigue of Cu interconnects 60 nm thick and 5–15 lm wide was investigated by using alternating current to generate cycling temperature and strain/stress. The fatigue curves exhibit two regions, i.e. highand low-cycle regions, which correspond to low and high thermal strains, respectively. The high-cycle region is found to be controlled by an unusual thermal fatigue mechanism of damage bands, which is related to a unique structure comprising only a single layer of grains distributed along the thickness. 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
منابع مشابه
Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based intermetallic compounds (IMCs) after reflow. In an effort to improve IMC based interconnects, an attempt is made to add Ni to Cu-Sn-based IMCs. Multilayer interconnects consisting of stacks of C...
متن کاملA fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects
In this research the quality of the interconnects of the ultrasonically welded Cu terminals to the Cu substrate in the IGBT-module has been investigated. An ultrasonic resonance fatigue system in combination with a laser Doppler vibrometer and a special specimen design was used for shear fatigue testing of these large ultrasonic Cu–Cu welds (about 0.5 cm). Fatigue life curves up to 10 loading c...
متن کاملEpitaxial TiN(001) wetting layer for growth of thin single-crystal Cu(001)
Single-crystal Cu(001) layers, 4-1400 nm thick, were deposited on MgO(001) with and without a 2.5-nm-thick TiN(001) buffer layer. X-ray diffraction and reflection indicate that the TiN(001) surface suppresses Cu-dewetting, yielding a 4 lower defect density and a 9 smaller surface roughness than if grown on MgO(001) at 25 C. In situ and low temperature electron transport measurements indicate th...
متن کاملCopper Manganese Spinel Coating on a Ferritic Stainless Steel for SOFC Application
Nowadays, Because of daily reduction of fossil fuels and environmental problems caused by using them, Fuel Cells attracted a major attention as clean and efficient way of generating electrical power. Solid Oxide Fuel Cells (SOFCs) have many advantages to other fuel cell types. High working temperature of SOFCs caused serious challenges including high oxidation rate of interconnects, Spallation ...
متن کاملElectric Current Induced Thermomechanical Fatigue Testing of Interconnects
We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current density, we used controlled Joule heating to simulate in an accelerated manner the type of low frequency thermal stress cycles that an interconnect ...
متن کامل